One preferred approach of Physical Vapor Deposition (PVD) is Sputtering, which has countless item applications. Whereas commercial Sputter systems are often tailored to big scale manufacturing quantity of well-known processes, there is also a requirement for smaller sized range sputtering systems for research and development where flexibility is normally more vital than quantity throughput. These very same smaller sputtering systems can additionally offer for reduced volume first manufacturing.
This paper will review a few of the functions and also capabilities that could be available in smaller sized Sputter systems tailored to low volume job such as r & d, specifically using a confocal setup of multiple targets around the perimeter of a round turning substrate stage, all angled in toward it.
Smaller sized chamber size has advantages of reduced price as well as smaller laboratory footprint, and also using small circular cathodes likewise limits the financial investment needed for target products. At today’s prices, a huge gold target may cost nearly as high as the piece of equipment. Also, those small round cathodes, offered readily from several resources, almost always have clamp on targets, making target product modifications quickly and easy and also making it sensible to be able to have and also use targets of countless various products to support growth work with several fronts.
It is feasible to set up such a system in any kind of desired alignment, for sputter down, sputtering machine up, or sputter flat. This full tri axis capability could utilize any type of preferred pumping setup such as cryo or turbo. It is also feasible to have just a basic solitary chamber, to be completely ducted for filling and discharging, or to add either a guidebook or mechanized transfer arm load lock.
One key configuration element for maximal flexibility is a turning substrate phase centered within a ring of cathodes such that they are all angled in towards it in a confocal setup providing each the capability to give ample deposition coverage across the entire phase surface area as it revolves, providing acceptable uniformity on the substrate or substrates. With ample power materials and controls, these cathodes can be terminated separately or could be terminated two (or even more) at a time for co-deposition.
Any type of desired kind(s) and also amount of cathode power supplies can be made use of, such as RF, DC, or pulsed DC. But these power materials will be smaller than the ones required for large high quantity tools, as well as thus cheaper, as well as the reduced power cathodes minimize the need for such facility assistance as overall electric power required or cooling water needed.
Gas systems can consist of numerous gas networks, as would certainly be preferred for reactive sputtering, and also can have either upstream or downstream pressure control as desired.
An additional feature that can include in the total flexibility for experimentation and also process advancement is to have substrate stage temperature level capability. The majority of generally this is a phase heating unit, yet some degree of air conditioning, while a little bit extra included, is additionally feasible. Such optional things as substrate prejudice can likewise be done, along with attributes such as sputter etch or ion light beam.